Nonvolatile semiconductor memory device

ABSTRACT

A nonvolatile semiconductor memory device having a plurality of electrically rewritable nonvolatile memory cells connected in aeries together is disclosed. A select gate translator is connected in series to the serial combination of memory cells. A certain one of the memory cells which is located adjacent to the select gate translator is for use as a dummy cell. This dummy cell is not used for data storage. During data erasing, the dummy cell is applied with the same bias voltage as that for the other memory cells.

CROSS-REFERENCE TO PRIOR APPLICATION

This application is a continuation of and claims the benefit of priorityfrom U.S. application Ser. No. 11/378,273, filed Mar. 20, 2006, which isa division of U.S. application Ser. No. 10/673,177, filed Sep. 30, 2003,now U.S. Pat. No. 7,079,437, issued Jul. 11, 2006. This application isbased upon and claims the benefit of priority from the prior JapanesePatent Application No. 2002-286055, filed on Sep. 30, 2002, the entirecontent of which is incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates generally to non-volatile semiconductor memorydevices and, more particularly, to electrically erasable programmableread only memory (EEPROM) devices of the NAND type.

2. Description of Related Art

In nonvolatile semiconductor memories, memory cells of a metal oxidesemiconductor (MOS) transistor structure with stacked floating andcontrol gates are generally used. In NAND type EEPROMs, a plurality ofsuch memory cells are connected in series to make up a NAND cell unit.One end of the NAND cell unit is connected through a select gatetransistor to a bit line; the other end is coupled via a select gatetransistor to a source line.

With miniaturization of memory cells, the distance between neighboringmemory cells within a NAND cell unit is becoming shorter. Due to this,the floating gate of a memory cell is becoming considerably larger notonly in capacitive coupling with respect to the memory cell's channelregion and control gate but also in capacitive coupling to the floatingand control gates of its neighboring memory cell.

In the case of NAND-EEPROMs, data write and erase are performed byapplying a voltage between a control gate and a channel (p-type wellregion) to thereby inject electrons from the channel onto the floatinggate in the form of a tunnel current or, alternatively, draw electronsout of the floating gate toward the channel. Principally in this case, apotential of the floating gate is determinable by a capacitive couplingratio, which is defined by a capacitance between the control andfloating gates and a capacitance between the floating gate and thechannel.

However, when the distance between memory cells is shortened, thecapacitance between neighboring memory cells affects the above-notedcoupling ratio. The series-connected memory cells within a NAND callunit are the same in structure as one another, and a variation factor ofthe coupling ratio among them in a form parameter. When looking at amemory cell which is located adjacent to a select gate transistor, itsone side in a memory cell, and the other side thereof is the select gatetransistor. The select gate transistor in different from the memory celland both in structure and in operating voltage. For this reason, thosememory cells next to select gate transistors are different inwrite/erase characteristics from the remaining memory cells.

A detailed explanation will be given of a data erase event withreference to FIG. 13 below. In FIG. 13, there is shown a biasrelationship during data erasing with respect to a range within a NANDcall unit, which includes a select gate transistor on the bitline BLside and its subsequent two memory cells. Data erase is such that“all-at-a-time” erase. In performed in units of blocks. In the case,apply a voltage of zero volts (0V) to all word lines WL while applyingan erase voltage Vera of 18V (Vera=18V) to a p-type well region. Set aselect gate SG and a bit line BL in an electrically floating state.Although not shown in FIG. 13, a source line and a select gate line onthe source line side also a similarly set in the floating state.

Whereby, at a memory cell, electrons on its floating gate FG arereleased or drawn out into the channel thereof. At this time, in amemory cell of a word line WL0 adjacent to a select gate line SGD, thepotential of its floating gate FG is affected by a capacitance C3between the floating gate FG and the select gate SG. More specifically,when setting the select gate SG in the floating state, its potentialbecomes almost equal to the erase voltage Vera of the p-type well. Theresult of this is that the floating gate FG of the memory cell of wordline WL0 becomes higher in potential than floating gates of the othermemory cells due to the presence of the coupling via the capacitance C3between itself and control gate SG. This potential increase causes thememory cell of interest to be difficult to be erased. The same goes witha memory cell that is selected by a word line in close proximity to aselect gate line on the source line side.

FIG. 14 graphically shows threshold voltages after data erase (EraseVth) of a text structure with respect to each of sixteen word lines WL,wherein the test structure has a NAND call unit made up of sixteenmemory cells. The erase threshold voltages of the memory cellsassociated with word lines WL0 and WL15 next to the select gates arehigher by about 0.8V than those of the other memory calls (i.e. thecells connected to word lines WL1-WL14).

A similar problem occurs in data write events. Data write is performedby setting the p-type well at 0V, precharging the channels of a NANDcell unit in a way pursuant to the data to be written, and thereafterapplying a write voltage Vpgm to a selected word line. Whereby, in amemory call which is given logic “0” data and whose channel is set atVss, electrons are injected onto the floating gate thereof. In a memorycell that is given logic “1” data with its channel being precharged toVoc and thus set in the floating state (namely, write inhibit memorycell), its channel potentially rises up due to the capacitive coupling80 that any electron injection hardly occurs. This write technique iscalled the “self-boosting” scheme. Non-selected word lines are appliedan intermediate voltage to ensure that hold data are not destroyed.

FIG. 15 shows word-line dependency characteristics of after-writethreshold voltages (Program Vth) in the case of performing a writeoperation while sequentially applying write pulses to all of sixteenword lines within a NAND Cell unit. Regarding the word lines WL0 andWL15 that are located next to the select gate lines, these are differentin operation conditions during write from the other wordlines, due tothe capacitive coupling from the select gate lines. For this reason,writing is slower than writing of the other memory cells, with thethreshold voltage lowered by about 0.5V.

Additionally, an improved version of the self-boost scheme is available,which is aimed at efficient voltage boost control of only certain memorycells along a selected word line by applying the word lines neighboringupon the selected word line a voltage lower than that of the othernon-selected word lines. This scheme to known as “local self-boost”scheme (for example, see U.S. Pat. No. 6,011,287). The U.S. Pat. No.'287 also shows, in its FIG. 13, another example which sets the selectgate line not in the floating state but at 0V at the time of dataerasing.

It has been proposed to employ a technique for setting the thresholdvoltages of select gate transistors in a way conformity with operationconditions during data writing by taking account of the fact that thevoltage to be applied to select gate lines affects the writingcharacteristics (for example, refer to Published Japanese PatentApplication No. 11-86571). This handles as a problem a voltage to betransferred by a select gate transistor from a bit line toward a NANDcell channel.

As apparent from the foregoing, prior art NAND-EEPROMs are faced with aproblem which follows; as the device miniaturization makes progress, thecapacitive coupling of from a select gate transistor to its neighboringmemory cell becomes innegligible, resulting in an increase in valuevariation of erase threshold voltage and writs threshold voltage of thememory cells within a NAND cell unit.

SUMMARY OF THE INVENTION

In accordance with one aspect of this invention, a nonvolatilesemiconductor memory device in provided which has a plurality ofelectrically rewritable nonvolatile memory cells connected in series,and a select gate transistor connected in series to the series-connectedmemory cells. In the memory device, the memory cells include a memorycall located adjacent to the select gate transistor. This cell is adummy cell which is out of use for data storage.

In accordance with another aspect of the invention, a nonvolatilesemiconductor memory device has a plurality of electrically rewritablenonvolatile memory cells connected in series, and a select gatetransistor connected in series to the series-connected memory cells,wherein the memory cells include a certain memory cell adjacent to theselect gate transistor. This cell is applied with a bias voltagedifferent from a bias voltage of the remaining memory cells during dataerase.

In accordance with still another aspect of the invention, a nonvolatilesemiconductor memory device has a plurality of NAND call units eachhaving a serial combination of electrically rewritable nonvolatilememory cells, a first select gate transistor inserted between one end ofthe series-connected memory cells and a bit line, and a second selectgate transistor inserted between the other end of the series-connectedmemory calls and a source line. A respective one of the HAND cell unitsincludes memory cells which are located next to the first and secondselect gate transistors and which are dummy calls that are out of usefor data storage. During data erasing, the dummy cells are applied withthe same bias voltage as that of the remaining memory calls. During datareading and writing, the dummy cells are applied with the same biasvoltage as that of non-selected memory cells.

In accordance with a further aspect of the invention, a nonvolatilesemiconductor memory device has a plurality of NAND cell units eachhaving a serial combination of electrically rewritable nonvolatilememory cells, a first select gate transistor inserted between one end ofthe series-connected memory cells and a bit line, and a second selectgate transistor inserted between the other and of the series-connectedmemory cells and a source line. The memory device has a data erase modeand a data write mode. The erase mode is for erasing all memory callsformed within a well region at a time by holding control gates thereofat a low level while applying a high level of erase voltage to the wall.The data write mode is for giving to a selected memory cell a writepulse voltage with a step-like increase in voltage value. In the dataerase mode, a low level voltage which is given to the control gates ofthe memory cells next to the first and second select gate transistorsare set to a potential level that in lower then a voltage an given tocontrol gates of remaining memory calls. In the data write mode, theinitial value of a write pulse voltage used when the memory cells nextto the first and second select gate transistors are selected is set to apotential level higher than that when any one of the remaining memorycells is selected.

BRIEF DESCRIPTION or THE DRAWINGS

FIG. 1 is a block diagram showing a configuration of an EEPROM chip ofthe NAND type in accordance with an embodiment 1 of this invention.

FIG. 2 shows an equivalent circuit of a memory cell array of theembodiment 1.

FIG. 3 is a plan view of the memory call array.

FIG. 4 in a cross-sectional view of the cell array of FIG. 3 as takenalong line I-I′.

FIG. 5 is a diagram showing potential levels of bias voltages in read,erase and write modes of the embodiment 1.

FIG. 6 shows an equivalent circuit of a memory cell array of anembodiment 2.

FIG. 7 is a plan view of the memory cell array.

FIG. 8 in a sectional view of FIG. 7 along line I-I′.

FIG. 9 in a diagram showing a bias relationship of each operation modeof the embodiment 2.

FIG. 10 is a graph showing data threshold voltage distributions of data.

FIG. 11 graphically shows write pulse application examples of theembodiment 2.

FIG. 12 is a flow diagram showing a write sequence of the embodiment 2.

FIG. 13 is a diagram for explanation of a problem faced with one priorknown NAND-EEPROM.

FIG. 14 in a graph showing the word-line dependency characteristics oferase threshold voltage of prior art NAND-EEPROM.

FIG. 15 in a graph showing the wordline dependency characteristics ofwrite threshold voltage of prior art NAND-EEPROM.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of this invention will now be explained with reference tothe accompanying drawings below.

Embodiment 1

FIG. 1 shows a block configuration of an EEPROM chip of the NAND type inaccordance with one embodiment. A memory cell array 1 is arranged bylayout of NAND call units using electrically rewritable nonvolatilememory cells in a way an will be described in detail later. A senseamplifier and data latch circuit 2 functions an a sense amp circuit forsensing bit-line data of the memory call array 1 and also as a datalatch which retains write data.

Bit lines of the memory call array 1 are subjected to selection by acolumn decoder 3: word lines thereof are selected and driven by arow-decoder/word-line driver 5. Row and column addresses are supplied tothe row-decoder/wordline driver 5 and column decoder 3 through aninput/output (I/O) buffer 4 and also via an address register 6. Datatransfer and receipt are performed between the bit lines and externalI/O terminals.

A control circuit 7 is provided for performing sequence control of datawrite and erase operations. High voltages required for write and erasesessions are generated by a high-voltage generation circuit 8 inaccordance with an operation mode, wherein the high-voltage generator 8is controlled by the controller 7.

FIG. 2 shows an equivalent circuit of the memory cell array 1. Memorycells MC (MC0 to MC15) are such that each has a metal oxidesemiconductor (MOS) transistor structure with its floating gate and acontrol gate insulatively stacked over the floating gate. A plurality of(sixteen, in the illustrative example) such memory cells MC am connectedin series to thereby make up a NAND cell unit. A select gate transistorSG1 is inserted between one end of the NAND cell unit and a bit line BL;similarly, a select gate transistor SG2 is inserted between the otherand a source line SL.

In this embodiment, the NAND cell unit further includes a dummy call DC0which as inserted between the select gate transistor SG1 on the bitlineside and a memory cell MC0 neighboring upon this transistor SG1, and adummy call DC1 which is between the select gate transistor SG2 on thesource line side and a memory cell MC15 adjacent thereto. While thesedummy cells DC0-DC1 are principally the same in structure as the memorycells MC0-MC15, data write and read operations are not performed at thedummy cells DC0-1. In other words, dummy cells DC0-1 are not used asdata storage elements.

Each memory cell MC within the NAND cell unit has its control gate whichis connected to a corresponding one of word lines WL (WL0 to WL15). Aword line WL is commonly connected to control gates of a plurality ofmemory cells aligned in a direction parallel thereto. The select gatetransistors SG1 and SG2 have their gates which are provided andfabricated as select gate lines SGD and SGS extending in parallel to theword lines WL. Similarly, the dummy cells DC0-DC1 have control gatesthat are continuously formed as dummy word lines DWL0 and DWL1 inparallel to wordlines WL.

FIG. 3 shows a plan view of a single NAND cell unit. Also see FIG. 4,which is its cross-sectional view an taken along line I-I′. In a siliconsubstrate 10 of n type conductivity, a semiconductive well region 11 ofp type conductivity is formed. In this p-type well 11, a plurality ofNAND cell units are formed in the wordline direction. The range of suchmultiple NAND cell unite formed within the p-type wall 11 becomes ablock which is a unit for “all-at-a-time” or “all-at-once” data erase.

A memory call MC has a floating gate 13 which in a first-layerpolycrystalline silicon film as formed above the p-type well 1 with atunnel dielectric film 12 interposed therebetween and a control gate 15which in a second-layer polysilicon film as stacked over the floatinggate 13 with a dielectric film sandwiched therebetween. Control gate 15is continuously formed. In a one direction and becomes a word line WL.Dummy cells DC0 and DC1 are the same in structure as memory cells MC sothat their control gates 15 are similarly formed continuously to becomedummy word lines DWL0 and DWL1.

Select gate transistors SG1-SG2 have gate electrodes which are formed bypatterning techniques as control gate lines SGD-SGS, wherein afirst-layer polysilicon film which in the same as that of the memorycell floating gate 13 and a second-layer polysilicon film same as thatof memory cell control gate 14 are electrically connected together at anappropriate position. Gate electrodes 15 d and 158 of these select gatetransistors SG1-SG2 are formed so that each is wider than the individualone of control gates 15 of memory cells MC and dummy cells DC. Afterhaving formed and patterned these word lines WL and select gate lines,n-type diffusion layers 16 are formed. The n-type diffusions 16 are foruse as source/drain regions.

The memory cell array is covered or coated with an interlayer dielectricfilm 20. On this film 20, a source lines (SL) 21 is formed. Further, bitlines (BL) 23 are formed via an interlayer dielectric film 22.

Bias conditions for data read, erase and write operations in the EEPROMof this embodiment are shown in FIG. 5.

Data erase within a selected cell block is as follows. Let a bit line BLand select gate lines SGD and SGS be not in a floating state, set allthe word lines WL at 0V, and apply an erase voltage Vera=18V to a p-typewell. At this time, set dummy word lines DWL0-DWL1 also at 0V.

Whereby, electrons are drawn out of the floating gate of the memorycells within the selected block so that data are erased. While a writestate high. In threshold voltage with electrons stored on the floatinggate is regarded as data “0,” an erase state is defined as a data ‘1’state which is lower in threshold voltage than the former.

In the above-noted erase mode, the two dummy cells DC also are appliedwith the same voltage as the voltage being applied to the sixteen memorycells MC. Accordingly, this ensures that certain ones of the sixteenmemory cells MC0-MC15 for use as real data storage cells—i.e., thememory cell MC0 nearest to the bit line BL, and memory call MC15 nearestto the source line SL—are also identically the same in erase operationconditions as the remaining memory cells MC1 to MC14. More specifically,unlike the prior art, these memory cells MC0 and MC15 become free fromthe influence of the capacitive coupling from the select gate lines SGDand SGS so that their floating gates are applied with the same voltageas that at the other memory cells. In other words, the resultant erasespeed or rate stays constant with respect to all the memory cells MC.This makes it possible to reduce any possible variation in erasethreshold voltages within the NAND cells.

During data reading, precharge the bit line BL at Vb1=0.5V, for example.Thereafter, apply to a selected word line of the sixteen word lines aread voltage Vr which provides an ability to determine the thresholdvoltage distributions of data “0” and “1” shown in FIG. 10. Apply a passvoltage Vread to the remaining non-selected word lines and the dummyword lines DWL. This pass voltage Vread causes turn-on irrespective ofwhether the data in a logic “0” or “1”. Apply to the select gate linesSGD and SGS a power supply voltage Vcc (or alternatively an appropriateintermediate voltage higher than the supply voltage Vcc) by way ofexample. With such voltage application, in case a selected memory cellturns on. Its associated bit line potentially drops down; if the cellturns off, then the bitline potential is retained. Thus it in possibleat the bitline to detect whether the selected memory cell turns on oroff, thereby making it possible to achieve data determination.

At the time of data writing, apply a write voltage Vpgm to a selectedword line while applying an appropriate mid-level voltage Vpass to theother nonselected word lines and the dummy word lines DWL. The midvoltage Vpass is higher than the supply voltage Vcc. Note here thatprior to this write voltage application, either Vss or Vcc is given tothe bit line BL in accordance with write data “0”, “1” while setting thebitline side select gate line SGD at Vcc and the source-line side selectgate line SGS at 0V, thereby precharging the NAND call channels. Achannel with “0” data given thereto becomes at Vss, whereas a “1”data-channel becomes in the floating state of Vcc-Vth (Vth is thethreshold voltage of select gate transistor). By application of theabove-stated write voltage Vpgm in this state, a “0” data-given memorycall experiences electron injection from its channel onto floating gate.In a “1” data-given cell, its channel potentially rises up due to thepresence of capacitive coupling so that no electrons are injected to itsfloating gate. In this way, any memory cell with “0” data given theretoalong a word line becomes in the “0” write state that is high inthreshold voltage as shown in FIG. 10.

In this data write mode also, with the use of the dummy cells DC0-DC1which are applied with the same mid voltage Vpass as that of nonselectedword lines, the same write condition is establishable even when any oneof the sixteen memory cells is selected. Accordingly, variation ordeviation of write data within the NAND cell unit is lowered, therebyenabling improvement in uniformity of write threshold voltage values.

Also note that in the case of the embodiment, any complicated operationsdifferent from the prior art are not required with respect to theerase/write/read operations. Thus, the intended operations may beperformed successfully under much similar operating conditions to theprior art.

Another advantage of this embodiment is that the NAND cell unitsdecrease in influenceability of variations in on-chip elementcharacteristics in manufacturing processes thereof. This point will beexplained in detail below. Generally in semiconductor memories, it isbecoming more difficult to perform pattern formation at terminate endportions of a cell array which exhibit disturbance of periodicity withan increase in miniaturization of memory cells. In NAND-EEPROMs, one endof a NAND cell unit in connected to a source line SL, and the other andis coupled to a bit line BL. Select gate transistors are insertedbetween these source and bit lines and a cell array. It is thus requiredthat the select gate transistors SG be designed so that each is cut offdeeply enough to enable the NAND cell unit to be completely electricallydisconnected or isolated from its associated source line and bit linewhen the need arises. In view of this, transistors are used which aregreater in gate length than normal memory calls. As a result, thedistance or layout pitch of two select gate lines interposing contactportions of the bit line and source line is different from the distanceof word lines; further, a select gate line width is different from thewordline width. Therefore, the periodicity of the call array disturbs athere. In this way, the memory cell array looses the periodicity at itsend portions. This results in occurrence of an event that any requiredexposure and micro-patterning processes are no longer achievable withdesired feature sizes.

In this embodiment, the dummy cells are disposed between the select gatetransistors and the memory cells. Thus the periodicity becomes excellentin the range of the memory call array used for actual data storage. Thismakes the feature size uniform, resulting in on-chip elements beingequivalent in characteristics to one another. The dummy cells areencountered with no serious problems even when their sizes are littledeviated from a desired size, because these are not operated an realdata storage cells.

More specifically, in cases where such dummy cells are not disposed, aneed is felt to contrive a scheme for designing the distance betweenselect gate lines and word lines and also the wordline width in order tomaintain the wordline width constantly among cells. For example, makethe distance between a select gate line and its neighboring word linelarger than the distance between other word lines. In contrast, thisinvention is such that the dummy call in laid out in close proximity tothe select gate line. With this “dummy call layout” feature, disturbanceof the periodicity within the cell array becomes no longer occurrable.In addition, since the dummy cell is free from problems even when itsline width deviates slightly, it becomes possible to achieve the patternlayout with the minimum feature size. At this time, an area lossoccurring duo to the dummy cell layout to less in a practical sense.

Embodiment 2

A cell array equivalent circuit of a NAND-EEPROM in accordance with anembodiment 2 is shown In FIG. 6. A plan view and its cross-sectionalview along line I-I′ are shown in FIGS. 7 and 8. Parts or componentscorresponding to those of the previous embodiment 1 are denoted by thesame reference characters, with a detailed explanation eliminatedherein.

In this embodiment, a NAND cell unit has sixteen memory cells MC0 toMC15 and is similar to the prior art in call array configuration andstructure. This embodiment does not employ dummy cells such as thoseused in the embodiment 1. In such the NAND cell array, the wordlinedependency takes place in erase and write threshold voltage values whenusing the same erase and write methods as those in the prior art, as hasbeen stated previously.

Consequently in this embodiment, for the memory cells next to the selectgate transistors, apply a different bias voltage condition from theother cells to thereby remove the above-noted wordline dependency.

To be more concrete, FIG. 9 shows a bias relationship in each operationmode of this embodiment. Although the same 0-V voltage is ordinarilyapplied to every word line within a NAND cell unit at the time of dataerase, this embodiment is arranged to apply 0V only to certain wordlines WL0 and WL15 adjacent to the select gate lines SGD and SGS whileapplying to the remaining word lines WL1-WL14 a 0.7-V voltage higherthan the former. Note here that 0.7V is equivalent to a difference inthreshold voltage between the word lines WL0 and WL15 and the wordlinesWL1-WL14 in view of the wordline dependency of erase threshold voltageshown in FIG. 14. The other conditions are similar to those of the priorarts set the select gate lines SGD-SGS and source line SL plus bit lineBL in the floating state; and apply an erase voltage Vera-18V to thep-type well of an erase block.

By setting the low level voltage to be given to the control gates of thememory cells on the select gate side so that this voltage is lower thanthat given to the remaining memory cells in this way, it becomespossible to make the after-erase threshold voltage distribution uniform.Furthermore, it becomes possible to narrow the after-erase thresholdvoltage distribution, by comparing average values of the thresholdvoltages on a per-wordline basis after having erased by setting eachwordline at 0V and then letting a voltage corresponding to a deviationof the threshold voltage of a respective word line be the wordlinevoltage at the time of erase. At this time, with the threshold voltageof a memory cell which is the highest in erase threshold voltage (andthus is difficult to be erased) being as a reference value, apply avoltage that is potentially equivalent to a difference of such thresholdvoltage to a wordline during erasing.

As for data write, let the write pulse voltage step-up condition bedifferent between when the word line WL0 or WL15 next to the select gateline SGD, SGS is selected and when any one of the other wordlinesWL1-WL14 is selected. Although the “step write” technique is notspecifically explained in the previous embodiment, standard NAND-EEPROMsare designed to use a method for forcing a wordline voltage topotentially change in short and essentially uniform steps rather thancontinuously while at the same time confirming or checking write data ofa plurality of memory cell (a page of calls) along a singlewordline—that is, while verifying the resultant write state on a per-bitbasis.

More specifically, as shown in FIG. 12, set write data (S1), makecertain that the writing of all bits is not completed yet (S2), and setan initial value of the write pulse voltage Vpgm (S3). Then, apply awrite pulse (S4); thereafter, perform verify-read determination forverification of the resulting write state on a per-bit basis (S5). Ifthe judgment is NO, then cause the write pulse voltage to step up andthen repeat similar write and verify-read operations. When the verifytest is passed, invert a corresponding bit of the write data being held,and ensure that no write is done to such bit at later stages. And,determine that writing of all the bits corresponding to a page iscompleted (S2); then, terminate the write cycle.

FIG. 11 shows step-up voltages upon execution of the write cycle controlstated above in two events: when any one of the word lines WL1-WL14 inselected, and when wordline WL0. WL15 is selected. More specifically,when one of the wordlines WL1-WL14 is selected, let the initial value ofa write pulse voltage be set at Vpgm0. When wordline WL0, WL15 isselected, make use of an initial value Vpgm0+ΔV, which is little higherthan the value Vpgm0. As shown in FIG. 15, the memory cells on theselect gate transistor side tend to delay in write when compared to theremaining cells under the same write conditions. In contrast, with thewrite pulse initial value setting feature stated above, it is possibleto permit the execution number of write loops to stay constantregardless of any wordline, thus making it possible to obtain a uniformwrite threshold voltage distribution.

1. A nonvolatile semiconductor memory device, comprising: a cell unitincluding a plurality of electrically rewritable nonvolatile memorycells connected in series; a first dummy cell being out of use for datastorage, including a pair of ends, one of the ends of the first dummycell being connected to one end of the cell unit; a second dummy cellbeing out of use for data storage, including a pair of ends, one of theends of the second dummy cell being connected to the other end of thecell unit; a first select gate transistor including a pair of ends, oneof the ends of the first select gate transistor being connected to theother end of the first dummy cell; a second select gate transistorincluding a pair of ends, one of the ends of the second select gatetransistor being connected to the other end of the second dummy cell; abit line connected to the other end of the first select gate transistor;and a source line connected to the other end of the second select gatetransistor.
 2. The device according to claim 1, wherein a structure ofthe first and the second dummy cells are the same as a structure of thememory cell.
 3. The device according to claim 1, wherein each memorycell includes a floating gate and a control gate stacked on the floatinggate via an insulating film.
 4. The device according to claim 3, whereina structure of the first and the second dummy cells is the same as astructure of the memory cell.
 5. The device according to claim 1,wherein the first and the second dummy cells are applied with a biasvoltage being the same as a bias voltage for the memory cells duringdata erase.
 6. The device according to claim 1, wherein the first andthe second dummy cells are applied with a bias voltage being the same asa bias voltage of non-selected memory cells in data read and writeevents.
 7. A nonvolatile semiconductor memory device, comprising: asemiconductor substrate; a cell unit including a plurality ofelectrically rewritable nonvolatile memory cell transistors connected inseries, each memory cell transistor including a first gate electrodehaving a data storage layer formed on the semiconductor substrate via afirst insulator; a first dummy transistor including a second gateelectrode formed on the semiconductor substrate via a second insulator,the first dummy transistor being out of use for data storage, the firstdummy transistor being electrically connected to one end of the cellunit via a first diffusion layer formed in the semiconductor substrate,the first dummy transistor being applied with a predetermined biasvoltage during data erase or data write operation; a second dummytransistor including a third gate electrode formed on the semiconductorsubstrate via a third insulator, the second dummy transistor being outof use for data storage, the second dummy transistor being electricallyconnected to the other end of the cell unit via a second diffusion layerformed in the semiconductor substrate, the second dummy transistor beingapplied with the predetermined bias voltage during data erase or datawrite operation; a first select gate transistor including a fourth gateelectrode formed on the semiconductor substrate via a fourth insulator,the first select gate transistor being electrically connected to thefirst dummy transistor via a third diffusion layer formed in thesemiconductor substrate; a second select gate transistor including afifth gate electrode formed on the semiconductor substrate via a fifthinsulator, the second select gate transistor being electricallyconnected to the second dummy transistor via a fifth diffusion layerformed in the semiconductor substrate; a bit line electrically connectedto the first select gate transistor via a sixth diffusion layer; and asource line electrically connected to the second select gate transistorvia a seventh diffusion layer.
 8. The device according to claim 7,wherein the data storage layer includes a floating gate having apolycrystalline silicon film.
 9. The device according to claim 7,wherein a structure of the first and the second dummy transistors aresame as a structure of the memory cell.
 10. The device according toclaim 7, wherein the first and the second dummy transistors are appliedwith a bias voltage being the same as a bias voltage of non-selectedmemory cells in data write events.